Cat No:HPATBA-0010
A nanostructured Ti-Cu sputtering target produced by mechanical alloying and spark-plasma sintering. Its metastable beta/Ti2Cu structure is specified for combined hardness, electrical conductivity, antibacterial response, and thermal-management performance.
| Chemical Composition | Cu 5–40 wt.%; balance Ti |
| Electrical Conductivity (%IACS or MS/m) | ≥35% IACS; stated adjustable range 30–50% IACS |
| Thermal Conductivity (W/(m·K)) | 25–80 |
| Coefficient of Thermal Expansion (×10⁻⁶/K) | 7–10 |
| Molecular Formula | Ti-Cu |
| Purity/Assay | 99.5% |
| Form | Alloy sputtering target |
| Impurities | C <150 ppm; Fe <100 ppm |
| Processing Conditions | Mechanical alloying and spark-plasma sintering (SPS) |
| Oxygen Content (ppm) | <400 |
| Relative Density (%) | >99.3 |
| Grain Size | Titanium-matrix grains ≤3 μm |
| Phase Composition | Metastable beta phase and Ti2Cu phase; combined fraction >85% |
| Nanohardness (GPa) | >8; stated range 8–12 for deposited films |
| Electromigration Lifetime (h) | >1000 at 5×10⁴ A/cm² |
| RF Loss Tangent | ≤0.002 at 28 GHz |
| Thermal Shock Cycles | >5000 at ΔT = 200 °C |
| Interface Diffusion Zone (μm) | <0.01 after 1000 h |
| Precipitate Size (nm) | Ti2Cu: 20–100 |
| Phase Interface Bond Strength (MPa) | >150 |
| Electrical Contact Life (cycles) | >1×10⁶ |
| Bacterial Reduction (%) | >99.99 after 3 h against E. coli |
| Collagen Deposition Increase (%) | 280 |
| Friction Coefficient | <0.1 in the stated physiological environment |
| Thermal Resistance (K·m²/W) | <1×10⁻4 |
| Contact Resistance (mΩ·cm²) | <3 |
| Applications | Advanced semiconductor packaging and through-silicon vias; antibacterial orthopedic and surgical-device coatings; fuel-cell bipolar plates; thermoelectric interface layers; 5G thermal substrates; IGBT bonding layers |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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