99.9% Titanium Sputtering Target (Ti)

Cat No:HPMHPTN-0003

Description

A high-purity elemental titanium sputtering target with documented composition, purity and physical constants. The material is specified for semiconductor and vacuum-technology applications.

Datasheet

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Basic Information

Chemical Composition	Elemental titanium (Ti)
Molecular Formula	Ti
Molecular Weight (g/mol)	47.867
Purity/Assay	99.9%
Form	Sputtering target
Melting Point (°C)	1668
Density (g/mL or g/cm³)	4.506
Boiling Point (°C)	3287
Deposition Method	Sputtering
Material	Titanium

Applications

Semiconductor materials; getters for high and ultrahigh vacuum, especially for hydrogen, methane and carbon dioxide; sputtered circuit interconnects; barrier-layer metal.

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