Cat No:HPMHPC-0002
This oxygen-free copper strip features exceptional purity with no hydrogen embrittlement risk. The material delivers excellent electrical and thermal conductivity combined with superior cold forming performance. Very good electroplating, hot-dip tinning and soft soldering characteristics make it ideal for demanding electronic applications.
| Alloy System | Cu-OF (C10200 / Cu-OF / TU3) |
| Chemical Composition | Cu ≥99.95% |
| Density (g/cm³) | 8.94 |
| Electrical Conductivity (%IACS or MS/m) | 100% IACS at 20°C, 58 MS/m |
| Thermal Conductivity (W/(m·K)) | 391 |
| Elastic Modulus (GPa) | 115 |
| Coefficient of Thermal Expansion (×10⁻⁶/K) | 17.7 (20-300°C) |
| Tensile Strength (MPa) | R220: 220-260; R245: 240-300; R290: 290-360; R360: ≥360 |
| Yield Strength (MPa) | R220: ≤140; R245: ≥180; R290: ≥250; R360: ≥320 |
| Hardness (HV) | R220: 40-70; R245: 65-95; R290: 90-110; R360: ≥110 |
| Elongation (%) | R220: ≥33; R245: ≥8; R290: ≥4; R360: ≥2 |
| Bendability | Thickness ≤0.5mm, width 10mm; R220: 90° bend at 0R/T good way and bad way; R245: 0R/T; R290: 0R/T; R360: 0R/T |
| Strip Thickness (mm) | 0.08-4.0 |
| Strip Width (mm) | Minimum 8.5 |
| Coil Outside Diameter (mm) | Up to 1300 |
| Coil Weight (kg) | Traverse-wound up to 500; multiple-coil up to 3000 |
| Fatigue Strength | Typically one-third of tensile strength; for solid solution fine grain materials may increase to 0.5× tensile strength |
| Fabrication Properties | Cold forming: excellent; machining: average; electroplating: excellent; hot-dip tinning: excellent; laser welding: not suitable; resistance welding: good; soft soldering: excellent |
| Applications | Signal connectors, power connectors, semiconductor lead frames, busbars, switching elements, telecommunication cables |
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For Research or Industrial Raw Materials, Not For Personal Medical Use!
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