High-Purity Copper Powder, 99.9%, −200 Mesh product detail at Eata Ray
High-Purity Copper Powder, 99.9%, −200 Mesh
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High-Purity Copper Powder, 99.9%, −200 Mesh

Cat No:HPMHPC-0005

Description

A fine orange-red copper metal powder with high electrical and thermal conductivity. Its controlled oxygen, sulfur and trace-metal levels support conductive formulations, powder metallurgy and precision industrial applications.

Basic Information

Chemical Composition Cu ≥99.9%; water <0.04%; O <0.08%; S <0.006%; As <0.005%; Pb <0.03%.
Molecular Formula Cu
Molecular Weight (g/mol) 63.55
Purity/Assay 99.9%
Form Metal powder
Particle Size −200 mesh
EC Number 231-159-6
MDL Number MFCD00010965
Application Area Conductive materials, powder metallurgy, catalysts and electromagnetic shielding
Appearance Orange-red metal powder.
Oxygen Content (%) <0.08
Water Content (%) <0.04

Applications

Applications Powder metallurgy; metal injection molding; friction components; diamond tools; catalysts; conductive oils and greases; electromagnetic shielding.

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