| Chemical Composition | Cu ≥99.9%; water <0.04%; O <0.08%; S <0.006%; As <0.005%; Pb <0.03%. |
| Molecular Formula | Cu |
| Molecular Weight (g/mol) | 63.55 |
| Purity/Assay | 99.9% |
| Form | Metal powder |
| Particle Size | −200 mesh |
| EC Number | 231-159-6 |
| MDL Number | MFCD00010965 |
| Application Area | Conductive materials, powder metallurgy, catalysts and electromagnetic shielding |
| Appearance | Orange-red metal powder. |
| Oxygen Content (%) | <0.08 |
| Water Content (%) | <0.04 |
| Applications | Powder metallurgy; metal injection molding; friction components; diamond tools; catalysts; conductive oils and greases; electromagnetic shielding. |
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