Only silver surpasses copper in intrinsic electrical conductivity — yet copper's abundance, processability, and cost structure have made it the undisputed backbone of modern electrical and electronic infrastructure. From the kilometer-long wiring harnesses in aircraft to the nanoscale damascene interconnects within microprocessor chips containing over 100 kilometers of copper wiring, this reddish-orange metal conducts not just electrons but the very flow of technological progress. Eata Energy supplies a comprehensive range of high-purity copper products engineered for applications where conductivity, thermal transfer, and material consistency cannot be compromised.
Our catalog spans grades from 4N (99.99%) through 6N (99.9999%) and beyond, encompassing standard OFC (Oxygen-Free Copper), OFHC (Oxygen-Free High Conductivity) C10100/C10200, and ultra-high-purity variants for quantum device research. Available in foil, wire, rod, powder, sputtering targets, and custom-configured forms, each product ships with full traceability documentation and analytical certification.
Copper's position in Group 11 of the periodic table endows it with a half-filled 4s electron shell and a filled 3d subshell — an electronic configuration that explains its extraordinary conductivity and characteristic reddish color. The table below details the key physical properties that define copper's utility across research and industrial domains.
| Property | Value | Notes |
| Atomic Number | 29 | Group 11, Period 4 |
| Atomic Weight | 63.55 g/mol | Two stable isotopes |
| Density | 8.96 g/cm³ | |
| Melting Point | 1085°C | |
| Boiling Point | 2562°C | |
| Electrical Conductivity | 101% IACS | OFC grade at 20°C |
| Thermal Conductivity | 401 W/m·K | Second only to silver |
| Electrical Resistivity | 1.673 μΩ·cm | @ 20°C |
| CAS Number | 7440-50-8 | EINECS: 231-159-6 |
| Young's Modulus | 110–128 GPa |
Figure 1: High-conductivity copper wire on industrial reels ready for electrical and research applications
Two stable isotopes dominate natural copper: ³Cu (69.17%) and ³Cu (30.83%). The 63Cu isotope's nuclear spin of 3/2 interacts with magnetic fields in ways exploited by NMR spectroscopists and condensed-matter physicists studying copper-based superconductors. For electronic and thermal applications, isotopic composition has negligible effect, but specialized research may specify isotopically enriched or depleted material.
Eata Energy maintains inventory across the complete range of copper product geometries, each suited to distinct processing methodologies from thin-film deposition through heavy electrical conductor fabrication.
Our copper foils serve as substrates for lithium-ion battery current collectors, flexible printed circuit laminates, and experimental platforms for 2D materials research. Rolled to tight thickness tolerances with controlled surface roughness for optimal coating adhesion.
Bare and insulated copper wire configurations support electromagnetic coil winding, electrical testing, and experimental setups requiring known-conductivity conductors.
Figure 2: Stack of mirror-finish high-purity copper foil sheets fanned for inspection
Full-density sputtering targets enable PVD deposition of copper seed layers, interconnects, and reflective coatings. Hot-isostatic pressing achieves >99.5% theoretical density with fine, uniform grain structure for consistent sputter profiles and extended target life.
Solid forms provide feedstock for in-house machining, alloy development, and powder metallurgy processes. Electrolytic refining ensures low oxygen and controlled trace element profiles.
Since IBM introduced copper damascene interconnects in 1997, copper has displaced aluminum as the conductor of choice for on-chip wiring. A modern microprocessor may contain tens of interconnect layers with a total copper wire length approaching 100 kilometers. The shift to copper reduced wiring resistance by approximately 40% compared with aluminum, enabling higher clock speeds and lower power consumption. Eata Energy's 5N and 6N copper targets and evaporation materials support research into sub-3 nm node interconnects, where impurity control at the ppb level directly influences electromigration resistance and yield.
Figure 3: Close-up of copper damascene interconnect pattern on a semiconductor device wafer
At cryogenic temperatures, 6N copper (99.9999%) exhibits ultra-low electrical loss and exceptionally high thermal conductivity — properties critical for superconducting microwave cavities, quantum computing interconnects, and single-photon detector housings. Goodfellow and other research suppliers have documented that impurity-related scattering in standard electronic-grade copper introduces resistive losses and thermal instability that can compromise device performance at millikelvin temperatures. Our 6N copper foils and machined components address these challenges by virtually eliminating impurity-induced defects.
With thermal conductivity of 401 W/m·K, copper ranks second only to silver among pure metals. This property makes it indispensable for heat sinks, cold plates, heat spreaders, and vapor chamber cores in power electronics, LED lighting systems, and high-performance computing. OFHC copper (C10100) maintains conductivity values of 100% IACS even after brazing and thermal cycling, ensuring reliable heat transfer in mission-critical cooling systems.
Thin copper foil (typically 8–12 μm) serves as the anode current collector in lithium-ion batteries, providing electron transport pathways while minimizing cell weight. As battery manufacturers push toward higher energy densities, research into ultrathin copper foils (sub-6 μm) and composite current collectors with polymer cores has intensified. Our rolled copper foils with controlled surface roughness optimize electrode coating adhesion and electrical contact resistance.
Figure 4: High-purity copper sputtering target mounted in a PVD coating chamber
Copper forms the basis of numerous high-performance alloy systems: Cu-Be for non-sparking tools and springs, Cu-Ni for marine and coinage applications, Cu-Cr-Zr for resistance welding electrodes, and Cu-Ag for high-strength conductors. Our high-purity copper starting materials enable researchers to investigate alloy systems with controlled additions, studying precipitation hardening, solid-solution strengthening, and their effects on conductivity retention.
Copper purity nomenclature varies by industry. The matrix below correlates common designations with composition and typical use cases.
| Designation | Purity | Typical Applications |
| C11000 (ETP) | 99.9%+ | General electrical, busbar, architectural, heat exchangers |
| C10200 (OF) | 99.95% | Welded components, refrigeration tube, electrical where hydrogen exposure |
| C10100 (OFHC) | 99.99% | Semiconductor packaging, vacuum systems, superconductor stabilizer, waveguide |
| 4N (99.99%) | 99.99% | Sputtering targets, evaporation material, research-grade foil |
| 5N (99.999%) | 99.999% | Advanced semiconductor nodes, quantum device substrates, GDMS standards |
| 6N (99.9999%) | 99.9999% | Cryogenic cavities, superconducting qubit interconnects, highest-purity research |
Every copper batch undergoes multi-technique analysis to verify composition, microstructure, and physical properties before release.
Figure 5: Copper powder in a glass beaker alongside small copper ingots and braided wire
Eata Energy recognizes that standard catalog offerings may not address the specialized requirements of frontier research and advanced process development. Our engineering capabilities extend to custom copper products designed in collaboration with your technical team.
Consult our materials scientists during project planning to ensure optimal copper grade and form selection for your specific conductivity, thermal, or structural requirements.
| Catalog Number | Product Name | Order | Quantity |
|---|---|---|---|
| HPM-HCO-0025 | Precision High-Purity Copper Microspheres | Inquiry |
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