| Chemical Composition | Sn 99.95–99.999%. Typical maximum impurities: Fe 0.004%, Pb 0.005%, Cu 0.001%, S 0.001%, Bi 0.002%, As 0.002% and Sb 0.001%. |
| Molecular Formula | Sn |
| Molecular Weight (g/mol) | 118.71 |
| Purity/Assay | 99.95% or 99.999% |
| Form | Metal powder |
| Particle Size | −200 or −300 mesh |
| EC Number | 231-141-8 |
| MDL Number | MFCD00133862 |
| Application Area | Soldering, coatings, low-melting alloys, glass and chemical processing |
| Applications | Solder materials; corrosion-resistant metal coatings; low-melting alloys; glass manufacturing; specialty chemicals and metallurgical formulations. |
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