Ultra-High-Purity Titanium Sputtering Target

Cat No:HPM-HPT-0004

Description

Dense ultra-high-purity titanium target intended for stable sputtering and uniform metallic thin-film deposition.

Datasheet

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Basic Information

Form	Sputtering target
Purity	99.99% (4N)
EC Number	231-142-3
MDL Number	MFCD00011264
PubChem Substance ID	23963
UNSPSC Code	12141746
Chemical Formula	Ti
SMILES String	[Ti]
InChI	InChI=1S/Ti
InChI key	RTAQQCXQSZGOHL-UHFFFAOYSA-N
Atomic Number	22
Atomic Weight	47.86 g/mol
Valences Shown	+2, +3, +4
Crystal Structure	Hexagonal close-packed (α-Ti) at room temperature
Magnetic Order	Paramagnetic
Electronic Structure	[Ar] 3d² 4s²
Material Condition	Polycrystalline
Density	4.506 g/cm³ at 20°C
Melting Point	1668°C
Boiling Point	3287°C
Electrical Resistivity	54 µΩ·cm at 20 °C
Temperature Coefficient of Resistivity	0.0038/K@0-100°C
Superconducting Critical Temperature	0.4 K
Young’s Modulus	120.2 GPa
Bulk Modulus	108.4 GPa
Poisson’s Ratio	0.361
Tensile Strength	230-460 MPa
Yield Strength	140-250 MPa
Izod Toughness	61 J/m
Vickers Hardness (kgf mm⁻² )	60
Thermal Conductivity (W·m⁻¹·K⁻¹)	21.9@0-100°C
Coefficient of Thermal Expansion (×10⁻⁶ K⁻¹)	8.9@0-100°C
Specific Heat Capacity (J·kg⁻¹·K⁻¹)	523@25°C
Latent Heat of Fusion (J/g)	8893
Latent Heat of Evaporation (J/g)	365
Natural Isotope Distribution (Mass No./%)	⁴⁶Ti / 8.25%; ⁴⁷Ti / 7.44%; ⁴⁸Ti / 73.72%; ⁴⁹Ti / 5.41%; ⁵⁰Ti / 5.18%
Atomic Radius - Goldschmidt (nm )	0.147
Ionisation Potential (No./eV)	1st: 6.82812
Thermal Neutron Absorption Cross-Section (barns)	6.1
Photoelectric Work Function (eV)	4.1
Packaging Requirements	Packaged in aluminum-plastic composite bags and stored in a dry environment.

Applications

Adhesion and barrier layers, semiconductor metallization, optical coatings, biomedical surface coatings, sensors, and physical vapor deposition research.

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